● FEATURES 特性
1. High common mode impedance at high frequency effects excellent noise suppression performance.
高頻共模阻抗高，噪聲抑制性能優良.
2.20?~2000? are optional for different noise level and signal frequency
對于不同的噪聲電頻和信號頻率，選擇20?~2000?阻抗.
● APPLICATIONS 用途
1. USB 2.0 line for personal computers and peripheral
電腦和外圍設備的USB 2.0線路.
2. IEEE 1394 line for personal computers, DVC, STB
用于計算機、DVC、機頂盒的IEEE 1394線路.
3. LVDS, panel line for liquid display panels, graph card,etc. LVDS，用于液體顯示面板的面板線，圖形卡等.
● PART NUMBERING SYSTEM 品名系統
A: Type 型號 B: External Dimensions 外形尺寸 A*C
C: Material type 材料類型 D: Impedance Value 阻抗值 900 = 90?
E: Number of line 2P : 2-Line 雙線 F: Packaging : T=Taping and reel
● SHAPES AND DIMENSIONS 外形尺寸 (Unit:mm)
TYPE(型號) | A | B | C | D1 | D2 | E | F | G | H | K |
YZXMC2012S | 2.0±0.2 | 1.2±0.2 | 1.2±0.2 | 0.5 Ref | 0.45 Ref | 0.17 Max | 1.2 Ref | 0.4 Ref | 0.8 Ref | 2.0 Ref |
● STRUCTURE AND MATERIAL
● ELECTRICAL CHARACTERISTICS
1. Operating temperature range : -40℃～85℃(Including self - temperature rise)
2. Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
● TEST AND MEASUREMENT PROCEDURES
1. Common Mode Impedance(?)
Test equipment: Keysight E4991B / Agilent 4787A or equivalent
2. DC Resistance (DCR)
Test equipment: Agilent34420A / Agilent 4338B or equivalent
3. Rated Current (Irms)
Irms is direct electric current as chip surface temperature rose just 40 against chip initial surface temperature (Ta)
4. Insulation Resistance
Test equipment: Chroma or equivalent TH2683A / ZX6583
● RECOMMENDED SOLDERING TECHNOLOGIES
Re-flowing Profile
Preheat condition: 150~200 /60~120sec. Allowed time above 217C: 60~90sec.
Max temp: 260
Max time at max temp: 10sec Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2 times max
● SPECIFICATION TABLE:
YZXMC2012S Series
Part No. | Common Mode Impedance(?) | Test Frequency (MHz) | DCR (?) Max | Max. Rated Current (mA) | Rated Voltage (Vdc) | Insulation Resistance (M?) Min. |
YZXMC2012S-300-2P-T | 30±25% | 100 | 0.20 | 450 | 50 | 10 |
YZXMC2012S-670-2P-T | 67±25% | 100 | 0.25 | 400 | 50 | 10 |
YZXMC2012S-750-2P-T | 75±25% | 100 | 0.30 | 400 | 50 | 10 |
YZXMC2012S-900-2P-T | 90±25% | 100 | 0.30 | 330 | 50 | 10 |
YZXMC2012S-121-2P-T | 120±25% | 100 | 0.30 | 370 | 50 | 10 |
YZXMC2012S-181-2P-T | 180±25% | 100 | 0.35 | 330 | 50 | 10 |
YZXMC2012S-201-2P-T | 200±25% | 100 | 0.35 | 330 | 50 | 10 |
YZXMC2012S-221-2P-T | 220±25% | 100 | 0.40 | 300 | 50 | 10 |
YZXMC2012S-261-2P-T | 260±25% | 100 | 0.40 | 300 | 50 | 10 |
YZXMC2012S-371-2P-T | 370±25% | 100 | 0.45 | 280 | 50 | 10 |
YZXMC2012S-601-2P-T | 600±25% | 100 | 0.60 | 220 | 50 | 10 |
YZXMC2012S-751-2P-T | 750±25% | 100 | 0.70 | 180 | 50 | 10 |
YZXMC2012S-801-2P-T | 800±25% | 100 | 0.75 | 160 | 50 | 10 |
YZXMC2012S-901-2P-T | 900±25% | 100 | 0.80 | 150 | 50 | 10 |
YZXMC2012S-102-2P-T | 1000±25% | 100 | 0.80 | 150 | 50 | 10 |
1.Operating temperature range : -40℃～85℃(Including self - temperature rise)
2.Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
3.Rated Current (Irms)
Irms is direct electric current as chip surface temperature rose just 40 against chip initial surface temperature (Ta)
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